A Complete PCBA Manufacturing Services Company | Printed Circuit Board Assembly
With over 20 years of experience in Printed Circuit Board (PCB) Assembly, PARPRO has grown to become a one-stop electronic contract manufacturer for complete PCBA manufacturing & printed circuit board assembly services. With our specialized design for manufacturability (DFM) and our relentless dedication to in process quality control, leading OEMs rely on PARPRO for custom PCB assembly / testing of their most progressive and reliable embedded computing products. With North American headquarters in Southern California, we have PCBA manufacturing facilities in both USA and Mexico to provide the most affordable prices for the procurement of high-quality electronic components, making us an ideal supplier to both domestic and international customers/manufacturers. PARPRO is uniquely qualified to manufacture for OEM's in a variety of market spaces.
Check out PARPRO's PCBA manufacturing facilities in Santa Ana, California, and Tijuana, Mexico.
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From prototype to production, PARPRO provides competitively-priced custom PCBA services with a commitment to quality, performance and on time delivery.
PCB Assembly Services
Using the most advanced equipment, highly skilled and experienced personnel, and efficient processes, PARPRO undertakes all its PCBA manufacturing processes and operations in accordance with ISO 9001 / 13485 /14000 standards and in compliance with the IPC-A-600 and IPC-A-610 Acceptability of Printed Boards Standards. In addition, PARPRO offers serialization, component/lot traceability and reverse logistics, along with a full range of PCBA testing. Whether ICT, Bed of Nails, or Functional, we help our customers determine the appropriate level of test and execute according to customers order fulfillment model.
Our manufacturing capabilities include:
- Custom PCB Assembly
- Rigid Board
- Rigid-Flex PCB
- Flexible PCB & FFC
- SMT Assembly
FUJI High Speed Lines
Fine Pitch
BGA & Micro BGA X-Ray
01005 Package size capability
PoP – Package on Package
Rework Process and Verification
- Through-Hole Assembly
Selective Soldering
Wave Soldering
Lead Forming & Trimming
Press Fit
Rework, Process and Verification
OUR PCB ASSEMBLY CAPABILITIES
SMT(Surface-Mount Technology) | Assembly Lines | DIP & Assembly | ||
---|---|---|---|---|
8 SMT Lines | 6 Samsung Lines | 2 DIP & Assembly Lines | 2 Lines | |
Order Quantity | 1-5000 boards | 1-2000 boards | 1-1000 boards | 1-1000 boards |
Parts | MIN Bump Pitch(mm) 0.14 MIN Bump Diameter(mm) 0.07 MIN Bump Gap(mm) 0.07 | MIN Bump Pitch(mm) 0.2 MIN Bump Diameter(mm) 0.14 MIN Bump Gap(mm) 0.14 | ||
Component Package | Reels, Cut tape, Tube and tay, Loose parts and bulk | |||
PCB dimensions | Smallest size: 50mm x 50mm Largest size: 457mm x 356mm | Smallest size: 50mm x 50mm Largest size: 457mm x 395mm | L1000mm x W400mm | |
PCB shape | Rectangular Round Slots and Cut outs | Rectangular Round Slots and Cut outs | Rectangular Round Slots and Cut outs |
|
Testing Procedures | X-Ray (DAGE) AOI (Automated Optical Inspection) MIRTEC Stencil printing (DEK) SPI (CYBER) ON_LINE AOI (CYBER) Reflow (Vitronics Solter) Functional testing |