PCB Assembly Services
Using the most advanced equipment, highly skilled and experienced personnel, and efficient processes, PARPRO undertakes all its PCBA manufacturing processes and operations in accordance with ISO 9001 / 13485 /14000 standards and in compliance with the IPC-A-600 and IPC-A-610 Acceptability of Printed Boards Standards. In addition, PARPRO offers serialization, component/lot traceability and reverse logistics, along with a full range of PCBA testing. Whether ICT, Bed of Nails, or Functional, we help our customers determine the appropriate level of test and execute according to customers order fulfillment model.
Our manufacturing capabilities include:
- Custom PCB Assembly
- Rigid Board
- Rigid-Flex PCB
- Flexible PCB & FFC
- SMT Assembly
FUJI High Speed Lines
Fine Pitch
BGA & Micro BGA X-Ray
01005 Package size capability
PoP – Package on Package
Rework Process and Verification
- Through-Hole Assembly
Selective Soldering
Wave Soldering
Lead Forming & Trimming
Press Fit
Rework, Process and Verification
OUR PCB ASSEMBLY CAPABILITIES
| SMT(Surface-Mount Technology) | Assembly Lines | DIP & Assembly | ||
|---|---|---|---|---|
| 8 SMT Lines | 6 Samsung Lines | 2 DIP & Assembly Lines | 2 Lines | |
| Order Quantity | 1-5000 boards | 1-2000 boards | 1-1000 boards | 1-1000 boards |
| Parts | MIN Bump Pitch(mm) 0.14 MIN Bump Diameter(mm) 0.07 MIN Bump Gap(mm) 0.07 | MIN Bump Pitch(mm) 0.2 MIN Bump Diameter(mm) 0.14 MIN Bump Gap(mm) 0.14 | ||
| Component Package | Reels, Cut tape, Tube and tay, Loose parts and bulk | |||
| PCB dimensions | Smallest size: 50mm x 50mm Largest size: 457mm x 356mm | Smallest size: 50mm x 50mm Largest size: 457mm x 395mm | L1000mm x W400mm | |
| PCB shape | Rectangular Round Slots and Cut outs | Rectangular Round Slots and Cut outs | Rectangular Round Slots and Cut outs |
|
| Testing Procedures | X-Ray (DAGE) AOI (Automated Optical Inspection) MIRTEC Stencil printing (DEK) SPI (CYBER) ON_LINE AOI (CYBER) Reflow (Vitronics Solter) Functional testing |
